Patent of Heat Tunnel Board
Perfect match to all the high power, high temperature & high frequency components, such as:
- High Power LED
- MOSFET
- Power IC
- RF IC
Advantages of Heat Tunnel Board
- Lower thermal Resistance
- Rapid heat transfer
- Higher thermal conductivity
- Higher dielectric breakdown voltage
Patented Heat Tunnel Technologies
Patent No. PI2016000164, PI2015001737
With our patented Heat Tunnel PCB technologies, we are able to solve the bottleneck of MCPCB by providing you a Heat Tunnel Board that associates with thermal resistance of 1°C/W or lower. Like any other electronic components, the lifespan of the LED doubles with every 10 degree Celsius reduce in junction temperature (Tj).
*Increase in Tj ~ reduce in Vf.
6X2 XPL Streetlight Module
The picture on the left illustrates the Tj temperature of the Heat Tunnel Board has merely a difference of 1.8C from the heatsink’s surface. This has proven that heat transfers faster on Heat Tunnel Board as compared to MCPCB, which has a 23.4C difference from the heatsink’s surface.
Oslon Square Result
| Driving Current | |
| 1.4A | 1.4A |
| Tj on Heat Tunnel Board | |
| 62.4C (40 minutes) | 84.3C (150 minutes) |
| Tj on MCPCB(2W/MK) | |
| 75.3C (40 minutes) | 106.4C (150 minutes) |
| Delta | |
| 12.9C | 22.1C |
Technical Information
