Patented Heat Tunnel Technologies
Patent No. PI2016000164, PI2015001737
With our patented Heat Tunnel PCB technologies, we are able to solve the bottleneck of MCPCB by providing you a Heat Tunnel Board that associates with thermal resistance of 1°C/W or lower. Like any other electronic components, the lifespan of the LED doubles with every 10 degree Celsius reduce in junction temperature (Tj).
*Increase in Tj ~ reduce in Vf.
6X2 XPL Streetlight Module
The picture on the left illustrates the Tj temperature of the Heat Tunnel Board has merely a difference of 1.8C from the heatsink’s surface. This has proven that heat transfers faster on Heat Tunnel Board as compared to MCPCB, which has a 23.4C difference from the heatsink’s surface.
Oslon Square Result
|Tj on Heat Tunnel Board|
|62.4C (40 minutes)||84.3C (150 minutes)|
|Tj on MCPCB(2W/MK)|
|75.3C (40 minutes)||106.4C (150 minutes)|